Semiconductors

Arm and Samsung this week announced their joint design-technology co-optimization (DTCO) program for Arm's next-generation Cortex general-purpose CPU cores as well as Samsung's next-generation process technology featuring gate-all-around (GAA) multi-bridge-channel field-effect transistors (MBCFETs). "Optimizing Cortex-X and Cortex-A processors on the latest Samsung process node underscores our shared vision to redefine what’s possible in mobile computing, and we look forward to continuing to push boundaries to meet the relentless performance and efficiency demands of the AI era," said Chris Bergey, SVP and GM, Client Business at Arm. Under the program, the companies aim to deliver tailored versions of Cortex-A and Cortex-X cores made on Samsung's 2 nm-class process technology for various applications, including smartphones, datacenters, infrastructure, and various customized system-on-chips. For now, the companies does not...

TSMC: Ecosystem for 2nm Chip Development Is Nearing Completion

Speaking to partners last week as part of their annual Open Innovation Platform forum in Europe, a big portion of TSMC's roadshow was dedicated to the next generation of...

20 by Anton Shilov on 10/12/2023

Samsung Lines Up First Server Customer For 3nm Fabs

Although Samsung Foundry was the first contract fab to formally start mass production of chips on a 3 nm-class process, so far, the company's latest process has largely been...

5 by Anton Shilov on 10/12/2023

TSMC: Importance of Open Innovation Platform Is Growing, Collaboration Needed for Next-Gen Chips

This year TSMC is commemorating 15 years of its Open Innovation Platform, a multi-faceted program that brings together the foundry's suppliers, partners, and customers to help TSMC's customers better...

4 by Anton Shilov on 10/12/2023

GlobalFoundries Applies for CHIPS Money to Expand U.S. Fabs

Update 9/30: Correcting the number of companies interested in receiving support from the CHIPS fund. GlobalFoundries has applied for financial support from the U.S. CHIPS and Science Act to expand...

3 by Anton Shilov on 9/26/2023

TSMC Buys 10% Stake in IMS Nano from Intel

Intel and TSMC have announced an agreement in which TSMC will acquire a 10% stake in IMS Nanofabrication. IMS, controlled by Intel, produces multi e-beam photomask writing tools, whose...

0 by Anton Shilov on 9/12/2023

TSMC: Short Supply of HPC GPUs to Persist for 1.5 Years

The reports about an insufficient supply of compute GPUs used for artificial intelligence (AI) and high-performance computing (HPC) servers became common in recent months as demand for GPUs to...

6 by Anton Shilov on 9/7/2023

ASML to Deliver First High-NA EUV Tool This Year

In a promising sign for the development of the next generation of EUV lithography machines, ASML has revealed that the company is set to deliver the industry's first High-NA...

7 by Anton Shilov on 9/6/2023

Intel Foundry Services to Make 65nm Chips for Tower Semiconductor

In quite an unexpected turn of events, Intel on Tuesday announced that its foundry division would produce chips for contract chip maker Tower Semiconductor. Tower was a previous acquisition...

9 by Anton Shilov on 9/5/2023

Intel Calls Off Tower Acquisition, Forced to Focus Solely on Leading-Edge Nodes

Intel Corp. will not proceed with its $5.4 billion deal to acquire Tower Semiconductor foundry due to a lack of regulatory approval from China, the two companies announced on...

17 by Anton Shilov on 8/17/2023

Intel and Synopsys Ink Deal to Develop IP for Intel's 3 and 18A Nodes

Intel and Synopsys this week signed an agreement under which Synopsys will develop a portfolio of various IP offerings for Intel 3 and 18A fabrication technologies for Intel Foundry...

1 by Anton Shilov on 8/15/2023

TSMC Establishes Joint Venture to Build 12nm/16nm Fab in Europe

TSMC on Tuesday announced plans to establish a European Semiconductor Manufacturing Company (ESMC) joint venture with its partners Bosch, Infineon, and NXP to build a fab near Dresden, Germany...

10 by Anton Shilov on 8/8/2023

Intel Plans Massive Expansion in Oregon: D1X and D1A to Be Upgraded

Intel has filed a permit application that outlines significant expansion plans for its campus near Hillsboro, Oregon. According to filings submitted to state regulators, the tech giant's ambitious proposals...

4 by Anton Shilov on 8/2/2023

China Imposes New Export Restrictions on Gallium and Germanium

China this week formally imposed new export regulations on gallium and germanium, as well as materials incorporating them. This move is broadly seen as a retaliatory act for the...

6 by Anton Shilov on 8/2/2023

Dozens of Companies Adopt TSMC's 3nm Process Technology

Designing chips for modern, leading-edge manufacturing technologies is an expensive endeavor. Still, dozens of companies have already adopted TSMCs N3 and N3E (3 nm-class) fabrication processes, according to disclosures...

9 by Anton Shilov on 7/28/2023

Samsung Begins to Produce Third 3nm Chip Amid Massive Losses On DRAM & NAND

Samsung this week reported their financial results for the second quarter of 2023, closing the book on an especially bleak quarter of the year with a massive $3.4 billion...

14 by Anton Shilov on 7/28/2023

Rapidus Wants to Supply 2nm Chips to Tech Giants, Challenge TSMC

It has been a couple of decades since a Japanese fab has offered a leading-edge chip manufacturing process. Even to this day, none of the Japanese chipmakers have made...

19 by Anton Shilov on 7/26/2023

TSMC to Build $2.87 Billion Facility For Advanced Chip Packaging

TSMC on Tuesday announced plans to construct a new advanced chip packaging facility in Tongluo Science Park. The company intends to spend around $2.87 billion on the fab that...

3 by Anton Shilov on 7/25/2023

TSMC: 3nm Chips for Smartphones and HPCs Coming This Year

While TSMC formally started mass production of chips on its N3 (3nm-class) process technology late last year, the company is set to finally ship the first revenue wafers in...

21 by Anton Shilov on 7/21/2023

TSMC Delays Arizona Fab Deployment to 2025, Citing Shortage of Skilled Workers

TSMC on Thursday disclosed that it will have to delay mass production at its Fab 21 in Arizona to 2025, as a lack of suitably skilled workers is slowing...

27 by Anton Shilov on 7/20/2023

Samsung Shipping First GAAFET Silicon; 3nm and 4nm Yields Are Improving - Report

Currently, only two foundries offer their customers 3 nm and 4 nm-class process technologies: TSMC and Samsung Foundry. But business media sometimes blames Samsung Foundry for mediocre yields on...

5 by Anton Shilov on 7/18/2023

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