TSMC on Tuesday announced plans to establish a European Semiconductor Manufacturing Company (ESMC) joint venture with its partners Bosch, Infineon, and NXP to build a fab near Dresden, Germany. The new 300-mm fab will produce chips on TSMC's 28/22 nm and 16/12 nm-class process technologies, primarily for automotive and industrial sectors. As the project is planned under the European Chips Act framework, TSMC is set to get subsidies to build it. The proposed ESMC fab will be located near Dresden, Germany, and is slated to have a monthly production capacity of 40,000 300mm wafer starts per month. The fab is set to use TSMC's 28 nm family of production nodes, which includes several specialty manufacturing technologies and a 22 nm low-power fabrication process with planar...
Intel this week filed an lawsuit against Fortress Investment Group, a patent assertion entity controlled by SoftBank. Responding to a series of patent infringement lawsuits that Fortress has brought...21 by Anton Shilov on 10/23/2019
Marvell this morning has announced that it is selling off its Wi-Fi and Bluetooth chipset business to NXP Semiconductors in a $1.76 billion cash transaction. This business unit includes...4 by Billy Tallis on 5/29/2019
Qualcomm has announced today that the Board of Directors has rejected Broadcom’s proposal to acquire the company for around $105 billion. The BOD believes that Broadcom’s offering undervalues Qualcomm...14 by Anton Shilov on 11/13/2017
Broadcom on Monday said that it had proposed to acquire all of the outstanding shares of Qualcomm for $105 billion in total for cash and stock. If the buyout...12 by Anton Shilov on 11/7/2017
Qualcomm and NXP Semiconductors on Thursday announced that they had signed an agreement, under which Qualcomm will acquire NXP. The boards of both companies have already unanimously approved the...30 by Anton Shilov on 10/28/2016