Micron Sells Out Entire HBM3E Supply for 2024, Most of 2025
Being the first company to ship HBM3E memory has its perks for Micron, as the company has revealed that is has managed to sell out the entire supply of...
27 by on 3/22/2024
NVIDIA's GPU IP Drives into MediaTek's Dimension Auto SoCs
MediaTek this week has introduced a new lineup of Dimensity Auto Cockpit system-on-chips, covering the entire market spectrum from entry-level to premium. And while automotive chip announcements are admittedly...
5 by on 3/21/2024
AMD Announces FSR 3.1: Seriously Improved Upscaling Quality
AMD's FidelityFX Super Resolution 3 technology package introduced a plethora of enhancements to the FSR technology on Radeon RX 6000 and 7000-series graphics cards last September. But perfection has...
21 by on 3/21/2024
Ultra Ethernet Consortium Grows to 55 Members, Reveals Some Details on Upcoming HPC Backbone Tech
The Ultra Ethernet Consortium (UEC) has announced this week that the next-generation interconnection consortium has grown to 55 members. And as the group works towards developing the initial version...
8 by on 3/21/2024
Intel to Receive $8.5B in CHIPS Act Funding & Further Loans To Build US Fabs
Intel and the United States Department of Commerce announced on Wednesday that they had inked a preliminary agreement under which Intel will receive $8.5 billion in direct funding under...
20 by on 3/20/2024
SK Hynix Starts Mass Production of HBM3E: 9.2 GT/s
SK Hynix said that it had started volume production of its HBM3E memory and would supply it to a customer in late March. The South Korean company is the...
3 by on 3/19/2024
NVIDIA's 'cuLitho' Computational Lithography Adopted By TSMC and Synopsys For Production Use
Last year, NVIDIA introduced its cuLitho software library, which promises to speed up photomask development by up to 40 times. Today, NVIDIA announced a partnership with TSMC and Synopsys...
21 by on 3/18/2024
StarTech Unveils 15-in-1 Thunderbolt 4/USB4 Dock with Quad Display Support
StarTech.com has introduced its latest Thunderbolt 4/USB4 docking station, which has a plethora of ports and supports four display outputs. This makes it suitable for 4Kp60 quad-monitor setups often...
31 by on 3/18/2024
First DNA Data Storage Specification Released: First Step Towards Commercialization
The DNA Data Storage Alliance introduced its inaugural specifications for DNA-based data storage this week. This specification outlines a method for encoding essential information within a DNA data archive...
13 by on 3/15/2024
Asus Launches Low-Profile GeForce RTX 3050 6GB: A Tiny Graphics Card for All PCs
Asus this week has become the latest PC video card manufacturer to announce a sub-75W video card based on NVIDIA's recently-released low-power GeForce RTX 3050 6GB design. And going...
7 by on 3/15/2024
Asus Adds Support for 64GB Memory Modules to Intel 600/700 Motherboards
Asus on Thursday said it has released new versions of UEFI BIOS for DDR5-supporting Intel 600/700-series motherboards that enable support for 64 GB DIMMs. As a result, Asus's latest...
4 by on 3/14/2024
Western Digital Launches PC SN5000S SSD: Low-Cost Meets High Performance
Western Digital has introduced its new series of SSDs aimed at mainstream PCs, which combine high performance and low cost. The Western Digital PC SN5000S family of DRAM-less drives...
11 by on 3/14/2024
ASML Delivers First 2nm-Generation Low-NA EUV Tool, the Twinscan NXE:3800E
Our avid readers tend to look at microelectronics made using leading edge process technologies, which in case of Intel means usage of High-NA extreme ultraviolet (EUV) lithography a couple...
2 by on 3/13/2024
SiPearl's Rhea-2 CPU Added to Roadmap: Second-Gen European CPU for HPC
SiPearl, a processor designer supported by the European Processor Initiative, is about to start shipments of its very first Rhea processor for high-performance computing workloads. But the company is...
3 by on 3/8/2024
Marvell's 2nm IP Platform Enables Custom Silicon for Datacenters
Marvell this week introduced its new IP technology platform specifically tailored for custom chips for accelerated infrastructure made on TSMC's 2nm-class process technologies (possibly including N2 and N2P). The...
0 by on 3/8/2024
Intel CEO Pat Gelsinger to Deliver Computex Keynote, Showcasing Next-Gen Products
Taiwan External Trade Development Council (TAITRA), the organizer of Computex, has announced that Pat Gelsinger, chief executive of Intel, will deliver a keynote at Computex 2024 on June 4...
17 by on 3/8/2024
Intel to Hold Webinar to Discuss Long-Term Vision for Foundry, Separating Fab and Design Reporting
As Intel prepares to move its fabs into its new Intel Foundry business, it will change the way it reports results in the coming months. To discuss the company's...
1 by on 3/7/2024
Western Digital Issues Update on Company Split: CEOs for Post-Split Entities Announced
Now well in the midst of executing its plan to divide itself into separate hard drive and NAND businesses, Western Digital today offered a fresh update on the state...
27 by on 3/6/2024
JEDEC Publishes GDDR7 Memory Spec: Next-Gen Graphics Memory Adds Faster PAM3 Signaling & On-Die ECC
JEDEC on Tuesday published the official specifications for GDDR7 DRAM, the latest iteration of the long-standing memory standard for graphics cards and other GPU-powered devices. The newest generation of...
10 by on 3/6/2024
Apple Launches M3-Based MacBook Air 13 and 15: 3nm CPU for the Masses
Apple on Monday introduced its new generation MacBook Air laptops based on the company's most-recent M3 system-on-chip (SoC). The new MacBook Air notebooks come in the same sizes as...
48 by on 3/4/2024
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